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Automatic copper plating equipment
,second hand copper plating equipment
,PCB electroplating production line
Automatic PCB Copper Electral Plating Production Line
Process Flow:
Coarse grinding→Expansion→Desmear→Three-Stage Washing→Neutralization→Second-Stage Washing→Degreasing→Dilute Pickling→Second-Stage Sashing→Micro-Etching→Pre-Soaking→Activation→Second-Stage Washing→Accelerating→First-Stage Washing→Sinking Copper→Secondary Washing→Plate Surface Plating→Small Grinding→Copper Inspection
Origin: China
Maximum Board Size:610mm X 1100mm
Board Thickness: 0.2-6.0mm
Maximum Copper Thickness: 12oz
Minimum Mechanical Aperture: 0.15mm
Number of Layers: 2-30 L
Minimum Line Width & Spacing: 3/3mil
Impedance Control: +/-10%
Maximum Plate Thickness Aperture Ratio: 10:01
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