Garis Produksi Plating Elektronik Tembaga PCB Otomatis

Aliran Proses:

Coarse grinding→Expansion→Desmear→Three-Stage Washing→Neutralization→Second-Stage Washing→Degreasing→Dilute Pickling→Second-Stage Sashing→Micro-Etching→Pre-Soaking→Activation→Second-Stage Washing→Accelerating→First-Stage Washing→Sinking Copper→Secondary Washing→Plate Surface Plating→Small Grinding→Copper Inspection

Asal: Cina

Ukuran maksimum papan: 610mm X 1100mm

Ketebalan papan: 0,2-6,0 mm

Ketebalan Tembaga Maksimal: 12oz

Apertura Mekanis Minimal: 0,15 mm

Jumlah Lapisan: 2-30 L

Lebar garis minimum & jarak: 3/3mil

Pengendalian impedansi: +/-10%

Rasio aperture ketebalan plat maksimum: 10:01